GLOBALFOUNDRIES Silicon Technology Set to Enhance AMD's Next-Gen Products

By CIOReview | Tuesday, November 24, 2015

FREMONT,CA: GLOBALFOUNDRIES, a semiconductor foundry that manufactures integrated circuits in high volumes for AMD, Broadcom, Qualcomm and STMicroelectronics announces that it has achieved success on the first line of AMD products manufactured using the advanced 14nm FinFET process technology.

The silicon-proven technology will be integrated into multiple AMD products thereby addressing the growing need for high-performance, power-efficient compute and graphics SoC (System on Chip) technologies that are used in computers, data centers and immersive computing devices.

The 14nm FinFET technologies are the most advanced in the semiconductor industry. The 3D FinFET devices offer intrinsic performance boost over 28nm and 20 nm devices and provide a much superior power footprint compared to its predecessors. The leading edge devices also give cost advantage due to superior power, performance and area scaling.

 AMD has already rolled out multiple products using the GLOBALFOUNDRIES 14nm Low Power Plus (14LPP) process technology. The 14LPP platform taps the benefits of 3D, fully- depleted FinFET transistors, enabling customers to deliver more processing power in a smaller footprint for applications that demand the ultimate in performance.

“Through our close design-technology partnership with AMD, we can help them deliver products with a performance boost over 28nm technology, while maintaining a superior power footprint and providing a true cost advantage due to significant area scaling,” says Mike Cadigan, Senior VP of Product Management, GLOBALFOUNDRIES.