Adesto Technologies Announces Distribution Agreement with SemiDice

By CIOReview | Monday, August 31, 2015
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SUNNYVALE, CA: Adesto Technologies,a provider of low power memory solutions, collaborates with SemiDice, a bare die component supplier, to distribute bare die and wafers to high reliability applications.

"SemiDice offers unique capabilities in distribution with their special ability to handle and process die in wafer form,SemiDice offers unique capabilities in distribution with their special ability to handle and process die in wafer form,” says Jim Monteverde, Director of Global Distribution, Adesto.

Bare die is an unpackaged semiconductor device which is best suited in space restricted applications and provides switching efficiency and signal integrity.It is made out of a wafer, which is a slice of a semi conductor material like crystalline silicon, used in electronics for the fabrication of integrated circuits. These wafers are coated with different elements such as boron and phosphorus to create uniform electrical characteristics. Unlike packaged interconnects, bare die can improve reliability in systems cancelling out the possibility of threats due to mechanical or thermal stresses.

Furthermore,performance enhancements can also be obtained through bare die by packaging multiple bare dice together in hybrid circuits, Multiple Chip Modules (MCM), Multiple Chip Packages (MCP) or Systems-in-Package (SIP).Bare die are important to stacked chip or multi chip packages, and trends towards smaller devices lowering manufacturing costs, higher performance, longer battery life and improved integration.

Adesto's non-volatile memory die can help designers reduce costs and challenges of embedded flash scalability, as well as memory density and performance limitations. Adesto's memory solutions also address concerns related to embedded SRAM and Flash power consumption as process nodes continue to shrink.