Daimler AG and Qualcomm Partner to Bring Mobile Innovation to the Automotive World
FREMONT, CA: Automotive company Daimler AG and innovative semiconductor solutions company Qualcomm Technologies enter into a strategic partnership to take the connected car experience to a whole new level. Connected cars in modern times are analogous to digital mobile platform and Daimler looks forward to tap Qualcomm’s mobile solutions expertise in building intelligent, emission-free connected vehicles.
As part of the first phase of the collaboration, the focus will be laid on enhancing the in-car experiences and vehicle performance by leveraging Qualcomm’s mobile technologies including the implementation of 3G/4G connectivity and wireless charging technology.
Qualcomm Halo WEVC technology
Qualcomm has expertise in developing wireless charging technology solutions in the form of Wireless Power Transfer 2.0 high performance program for electric vehicles. The automotive company plans to implement Qualcomm Halo Wireless Electric Vehicle Charging (WEVC) technology in its production line so that its electric vehicle customers can charge their electric vehicles and plug-in hybrid electric vehicles without ever having to plug them in.
Additionally, Daimler customers can leverage Qualcomm’s WiPower technology to charge their consumer electronics devices wirelessly in-vehicle. Both the companies are jointly assessing more innovative automotive solutions from Qualcomm for implementation in cars built by Daimler. The mobile innovation company, Qualcomm, besides the wireless charging technologies in-vehicle, also offers solutions for communication, infotainment, safety and convenience in-vehicle through its Snapdragon Automotive Solutions.
“It’s important that we remain on the cutting edge of technology and continue to deliver unparalleled experiences to our customers,” says Prof. Dr. Thomas Weber, Member of the Board of Management of Daimler AG responsible for Group Research and Mercedes-Benz Cars Development. “With this in mind, we are eager to jointly explore possible fields of future cooperation with an internationally leading tech firm like Qualcomm.”
By James Seevers, CIO & GM, Toyoda Gosei
By Bill Krivoshik, SVP & CIO, Time Warner Inc.
By Gregory Morrison, SVP & CIO, Cox Enterprises
By Alberto Ruocco, CIO, American Electric Power
By Bruce. D. Smith, SVP & CIO, Information Systems, Advocate...
By Adrian Mebane, VP-Global Ethics & Compliance, The Hershey...
By Graham Welch, Director-Cisco Security, Cisco
By Michael Watkins, Senior Product Director, Global Knowledge
By Bernd Schlotter, President of Services, Unify
By Patrick Hale, CIO, VITAS Healthcare
By Steve Bein, VP-GIS, Michael Baker International
By Jason Alan Snyder, CTO, Momentum Worldwide
By Mike Morris, CIO, Legends
By Louis Carr, Jr., CIO, Clark County
By Bill Dow, SVP and General Manager of Business Solutions,...
By Jim Whitehurst, CEO, Red Hat
By Darren Cockrel, CIO, Coyote Logistics, a UPS Company...
By Nathan Johnson, SVP and CIO, Werner Enterprises [NASDAQ:...
By David Tamayo, CIO, DCS Corporation
By Neil Hampshire, CIO, ModusLink Global Solutions, Inc....