EDX Wireless Announced the Integration of Wireless Network Design Platforms with Remcom

By CIOReview | Thursday, March 24, 2016
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FREMONT, CA: EDX Wireless, a developer of network design tools, and Remcom, a provides innovative wireless communications and electromagnetic simulation software announced the integration of SignalPro with Wireless InSite X3D ray-tracing, starting with the release of SignalPro version 8.3.

Remcom’s X3D model significantly reduces calculation time, using GPU acceleration. The model serves a variety of service area environments including urban, indoor and indoor/outdoor, combing the effects from reflections, diffractions, and transmissions. EDX has now made the X3D model available as an add-on product, enabling users to take advantage of these features in SignalPro projects.

“We are pleased to be able to offer the Remcom X3D module as part of our product line-up and take network planning to that next level,” says Roger Skidmore, CEO of EDX Wireless.

The combination of SignalPro and X3D model is allowing engineers to track the three dimensional features of the environment where wireless networks will be deployed, which includes building structures, floorplans, and terrain elevations. This approach to network modeling demonstrates the interaction of signals with relevant features in the propagation environment, and at the same time delivers highly precise model of site specific network calculations. The accuracy of the predictions are assured by X3D’s exact path algorithm and the GPU acceleration ensures significant reduction in time to complete predictive simulations.

“X3D was developed to provide efficient and accurate predictions of propagation communication channel characteristics in complex environments,” says Ruth Silber Belmonte, product manager of Wireless InSite at Remcom. “With the X3D model’s efficient ray tracing processing capabilities, users will be able to include more complex scene elements in their analyses without sacrificing run time.”