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Examining ANSYS 19

By CIOReview | Wednesday, February 21, 2018

Fremont, CA: Engineering simulation received a major boost with the release of ANSYS 19—the comprehensive simulation-driven suite for product development by ANSYS [NASDAQ: ANSS]. Like its previous version (ANSYS 18), ANSYS 19 features the usual modules pertaining to 3D designs, fluids, electromagnetism, embedded software, semiconductors, systems, structures and so forth, but with added capabilities.

The 3D Design feature for ANSYS 19 is powered by ANSYS Discovery SpaceClaim, the frequently updated 3D modeler, which enables in-depth exploration of designs. The Electromagnetics suite that comes with an inbuilt machine design tool kit, has strong capabilities to support the design of wired and wireless modules. Ability for engineers to perform radar cross section analysis and integrated electro-thermal analysis are the two new features in Electromagnetics suite. The Embedded Software suite entails support for design of avionics software in accordance with the DO 178C standard, besides HMI capabilities compliant with the ARINC standards.

The Fluids suite in ANSYS 19 helps designers solve problems in computational fluid dynamics faster with improved accuracy, which guarantees greater productivity for engineers. The module also features EnSight—a package for post-processing and visualization that helps in the enhancing the simulation experience.  The structures suite, which is available solely for ANSYS Mechanical Enterprise license holders, features the separating, morphing, adaptive and re-meshing technology (SMART) fracture modeling that permits the simulation of crack growth using initial mesh distribution and orientation. The feature enables accurate predictions of crack propagation.

The Systems module, in addition to the features that existed earlier, supports power capabilities in two areas namely, simulation for design and deployment of battery management, and functional safety analysis. The semiconductor suite features the ANSYS RedHawk-SC platform that reduces the simulation time from days to hours to improve the design lapses. Features to display the chip design attributes affecting performance are also a part of ANSYS 19.