Kontron Announces the Launch of High Performance 3U VPX Board
FREMONT, CA: High Performance Computing (HPC) conjures vivid images of heavy equipments covering large real-estate, data scientists hurriedly monitoring, and huge capital expenditures are envisioned. This imagery is changing because of companies like Kontron, a provider of Embedded Computer Technology (ECT) and their dedication to Research and Development (R&D), revamping the notion of HPC through High Performance Embedded Computing (HPEC). “We are in everything: from simple devices like parking meter to very complicated medical devices, defense devices and even communication servers,” notes Kevin Rhoads, Executive Vice President – Business Unit Avionics, Transportation & Defense at Kontron
The firm has launched its High performance 3U VPX board based 8-core version of the Intel Xeon Processor D architecture. The Kontron VX3058 provides two 10 GBASE-KR ports and 8 lanes Gen3 PCI Express to the backplane. Bestowing more capabilities in a 3U footprint, the VX3058 also offers versatile mezzanine options for XMC, storage, graphics, M.2, and I/O. The M.2 interface can be used for storage or for integration of customized personality modules. Front I/O module options are selectable for DVI/HDMI, Ethernet or several other interfaces.
The integrated Kontron VX3058 enables enhanced computing capabilities with Dual 10 Gigabit Ethernet (GbE), high bandwidth PCI Express (PCIe) 3.0, and high speed DDR4 memory. The VX3058 is also power and cost (SWap-C) optimized and has been ruggedized for harsh environments size, and weight. Additionally, it facilitates Digital Signal Processing (DSP). The enhanced benefits make it perfect for military server and other HPEC applications like virtual machine architectures which take advantage of extensive capital and operational efficiencies provided by isolated workloads configured to dynamically share common resource. With the help of a single architecture, computing problems such as advanced imaging for unmanned system, sonar applications, and sensor processing in radar can be solved.
By Chris Tjotjos, VP, Cisco Solutions Practice, Black Box...
By Laura Jackson, Sr. Manager-Risk Management, ABS Consulting
By Jason Cradit, VP of Information Systems, Willbros Group
By Steve Garske, Ph.D., Senior Vice President & Chief...
By Roman Trakhtenberg, CEO, Luxoft
By Renee P Wynn, CIO, NASA
By Mike Morris, CIO, Legends
By Louis Carr, Jr., CIO, Clark County
By Andrew Macaulay, CTO, Topgolf Entertainment Group
By Dominic Casserley, President and Deputy CEO, Willis...
By Dave Nelson, SVP-Portfolio Lead, Avanade, Inc.
By Michael Cross, SVP & CIO, CommScope Holding Company Inc.
By Pauly Comtois, VP DevOps, Hearst Business Media
By Dan Adam, CIO, Extreme Networks
By Matt Schlabig, CIO, Worthington Industries
By David Tamayo, CIO, DCS Corporation
By Scott Cardenas, CIO, City and County of Denver
By Marc Kermisch, VP & CIO, Red Wing Shoe Co.
By Brian Drozdowicz, VP, Digital Services, Siemens...
By Les Ottolenghi, EVP and CIO, Caesars Entertainment