Xilinx Announces Next- Gen Technologies for Developers to Enhance Performance and Integration

By CIOReview | Friday, February 27, 2015

SAN JOSE, CA: Xilinx – a provider of all programmable technologies and devices – has introduced its new 16nm UltraScale+ family of FPGAs, 3D ICs and MPSoCs combining new memory; 3D-on-3D and multi-processing SoC (MPSoC) technologies. UltraScale+ family includes SmartConnect, a new interconnect optimization technology to enable higher level of performance and integration.

New UltraScale+ FPGA, SoC, and 3D IC applications include LTE Advanced and early 5G wireless, terabit wired communication, automotive ADAS and industrial IoT.

Memory Enhanced Programmable Devices: The new memory enhanced programmable devices include UltraRAM that delivers nearly 432 Mb of capacity. It provides optimal system power, flexibility, and predictable performance. With this designers can achieve high system performance/watt and reduces BOM costs. It is used to deliver high capacity on-chip memory for various cases including deep packet and video buffering. UltraRAM provides massive on-chip memory for SRAM device integration.

SmartConnect Technology: Xilinx has developed this interconnect optimization technology specially for FPGAs. This technology attacks the IP interconnect bottleneck through re-architected routing, clocking, and logic fabric at the system level and optimizes the interconnection for specific design requirements around throughput, latency and area. This technology alone provides 20-30 percent system level increase in performance per watt and area savings.

3D-on-3D Technology: Xilinx 3D ICs utilize stacked silicon interconnect (SSI) technology to deliver the highest logic density, bandwidth, on-chip resources and breaking new ground in system-level integration. The UltraScale+ portfolio uses the combined power of 3D transistors and third generation of Xilinx 3D ICs.

Heterogeneous Multi Processing Technology: UltraScale MPSoC architecture provides processor scalability from 32 to 64 bits with support for virtualization. The new Zynq UltraScale+ MPSoCs deploy all of the UltraScale+ FPGA technologies to enable true heterogeneous multiprocessing with ‘the right engines for the right tasks’ for smarter systems.

The processing sub-system is a 64-bit quad-core ARM Cortex-A53 processor for hardware virtualization, asymmetric processing and ARM TrustZone support. It also includes a dual core ARM Cortex-R5 real-time processor for deterministic operation, ensuring responsiveness, high throughput, and low latency for the highest levels of safety and reliability. It contains a security and safety processing system that delivers security solutions like secure boot; key and vault management; anti-temper capabilities. It also provides ARM Mail 400 MP graphic processor, H.265/264 Video Codec Unit, advanced dynamic power management unit.