Montage Technology: Delivering High-Performance, Low-Power IC-Based Solutions
Geof Findley, VP of Sales and Business DevelopmentFounded in 2004, the company’s forte lies in offering analog and mixed-signal semiconductor solutions for the home entertainment and cloud computing markets. Montage provides high-performance, low-power memory interface solutions with industry leading quality that enable memory-intensive server applications.
Delving into the depths of the company’s IC expertise, Findley notes that his company’s memory interface solutions portfolio comprises JEDEC-compliant double data rate (DDR) synchronous DRAM modules, including second-generation DDR (DDR2) advanced memory buffer, third-generation DDR (DDR3) register buffer, and fourth-generation DDR (DDR4) registering clock driver (RCD) and data buffer (DB).
Currently, Montage’s DDR4 supports both registered dual in-line memory modules (RDIMMs) and load-reduced dual in-line memory modules (LRDIMMs), which offer increased storage performance, scalability, and power efficiency for server and cloud computing applications. Presently, Montage is one of the only two DDR4 LRDIMM memory buffer suppliers validated by Intel; its products have expanded into the industry mainstream memory, server, and cloud computing field, supporting the global market. The company also recently introduced the new, fifth-generation DDR (DDR5) RCD and DB with an aim to reduce the effective load on the data buses and provide higher bandwidth, performance, and capacity for future servers. That being said, what truly makes Montage’s memory interface solutions the market leader in the semiconductor marketplace is its ability to achieve exceptional performance, top-notch reliability, and quality, which allows the servers to operate cost-efficiently.
Over the last decade, Montage has helped several customers across China, the U.S., and South Korea with its cutting-edge memory interface offerings. Going forward, Montage wants to be one of the frontrunners of the memory industry’s transition from DDR4 toward DDR5, and is working on additional memory interface products to efficiently address the need for increased memory capacity, lower power, and higher throughput speeds. Additionally, as security concern has become a critical issue throughout the IoT and edge computing industry, the company is also offering hybrid security DIMMs that provide additional security features at silicon level for servers and data centers.
Above all, the firm is on a constant mission to establish lasting relationships with leading memory suppliers and CPU manufacturers and remain aligned with their current and next-generation solutions. “In this ever-changing industry, tremendous opportunities are yet to be unveiled. And, Montage will continue to accelerate with focus and innovation and support cutting-edge technologies to spearhead the next big trend,” concludes Findley.
Over the last decade, Montage has helped several customers across China, the U.S., and South Korea with its cutting-edge memory interface offerings. Going forward, Montage wants to be one of the frontrunners of the memory industry’s transition from DDR4 toward DDR5, and is working on additional memory interface products to efficiently address the need for increased memory capacity, lower power, and higher throughput speeds. Additionally, as security concern has become a critical issue throughout the IoT and edge computing industry, the company is also offering hybrid security DIMMs that provide additional security features at silicon level for servers and data centers.
Above all, the firm is on a constant mission to establish lasting relationships with leading memory suppliers and CPU manufacturers and remain aligned with their current and next-generation solutions. “In this ever-changing industry, tremendous opportunities are yet to be unveiled. And, Montage will continue to accelerate with focus and innovation and support cutting-edge technologies to spearhead the next big trend,” concludes Findley.
Company
Montage Technology
Headquarters
San Jose, CA
Management
Geof Findley, VP of Sales and Business Development
Description
A global leading fabless semiconductor provider of high-performance IC based solutions for cloud computing and artificial intelligent markets
