Montage Technology | Top 20 HPC Solution Company - 2019
Montage Technology: Delivering High-Performance, Low-Power IC-Based Solutions
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CIOREVIEW >> High Performance Computing >> Montage Technology

Montage Technology has been recognized by CIOReview Magazine as the recipient of “Top 20 HPC Solution Companies - 2019,” based on our proprietary methodology, reflecting its position in the industry. This profile has been developed by the CIOReview research and editorial team based on insights from an interview with Geof Findley, VP of Sales and Business Development.

Montage Technology
Delivering High-Performance, Low-Power IC-Based Solutions

Montage Technology

Geof Findley, VP of Sales and Business Development
High volume servers (HVS) have never been more imperative than today, where massive amounts of data are constantly being transmitted through data centers. To ensure the data flow through networks is as smooth as possible, one of the indispensable facets is dynamic random-access memory. Server memory helps HVS achieve the required performance while also improving its memory capacity. Realizing the potency of DRAMs, today, numerous fabless companies are striving to strike its impact in the semiconductor market. Leading this pack is Montage Technology. The company focuses on developing high-speed, lower-power consuming memory interface solutions for servers and data centers. “We are a 15-year-old globally-operating semiconductor firm that designs and develops the piece of silicon that is incorporated within memory modules of the enterprise servers to increase their memory density and data transmission rate,” says Geof Findley, VP of sales and business development at Montage.

Founded in 2004, the company’s forte lies in offering analog and mixed-signal semiconductor solutions for the home entertainment and cloud computing markets. Montage provides high-performance, low-power memory interface solutions with industry leading quality that enable memory-intensive server applications.

Delving into the depths of the company’s IC expertise, Findley notes that his company’s memory interface solutions portfolio comprises JEDEC-compliant double data rate (DDR) synchronous DRAM modules, including second-generation DDR (DDR2) advanced memory buffer, third-generation DDR (DDR3) register buffer, and fourth-generation DDR (DDR4) registering clock driver (RCD) and data buffer (DB).

Currently, Montage’s DDR4 supports both registered dual in-line memory modules (RDIMMs) and load-reduced dual in-line memory modules (LRDIMMs), which offer increased storage performance, scalability, and power efficiency for server and cloud computing applications. Presently, Montage is one of the only two DDR4 LRDIMM memory buffer suppliers validated by Intel; its products have expanded into the industry mainstream memory, server, and cloud computing field, supporting the global market. The company also recently introduced the new, fifth-generation DDR (DDR5) RCD and DB with an aim to reduce the effective load on the data buses and provide higher bandwidth, performance, and capacity for future servers. That being said, what truly makes Montage’s memory interface solutions the market leader in the semiconductor marketplace is its ability to achieve exceptional performance, top-notch reliability, and quality, which allows the servers to operate cost-efficiently.

Over the last decade, Montage has helped several customers across China, the U.S., and South Korea with its cutting-edge memory interface offerings. Going forward, Montage wants to be one of the frontrunners of the memory industry’s transition from DDR4 toward DDR5, and is working on additional memory interface products to efficiently address the need for increased memory capacity, lower power, and higher throughput speeds. Additionally, as security concern has become a critical issue throughout the IoT and edge computing industry, the company is also offering hybrid security DIMMs that provide additional security features at silicon level for servers and data centers.

Above all, the firm is on a constant mission to establish lasting relationships with leading memory suppliers and CPU manufacturers and remain aligned with their current and next-generation solutions. “In this ever-changing industry, tremendous opportunities are yet to be unveiled. And, Montage will continue to accelerate with focus and innovation and support cutting-edge technologies to spearhead the next big trend,” concludes Findley.

Montage Technology

News

Montage Technology Introduces 4th-Gen DDR5 RCDs Enabling Data Rates up to 7200 MT/s

Monday, January 08, 2024

SHANGHAI -- Montage Technology, a leading data processing and interconnect IC company, today introduced its 4th-gen DDR5 Registering Clock Driver (RCD), also called DDR5 RCD04, to the industry. Designed for DDR5 RDIMM memory modules, this chip supports blazing-fast data rates up to 7200 MT/s, a 50% increase over the 1st-gen DDR5 RCDs.

Montage Technology introduces its latest innovation: the DDR5 Gen4 Registering Clock Driver (RCD04). Renowned for pioneering memory interface technologies, Montage has been instrumental in shaping JEDEC standards for DDR5 RCD chips. The company continues to invest significantly in R&D to drive continuous product advancements.

Having introduced its initial DDR5 memory interface and supporting chips in 2021, Montage swiftly followed with the second and third generations in 2022 and 2023 respectively. This consistent evolution has positioned Montage as a frontrunner in DDR5 RCD chip development.

The unveiling of the fourth-generation DDR5 RCDs marks another significant milestone, reaffirming Montage's leadership in memory interface chips. These cutting-edge DDR5 RCD04 engineering samples are now being distributed to prominent memory manufacturers, empowering the creation of next-generation DDR5 memory modules.

"The RCD chip sits at the heart of the memory module, serving as the vital channel for data exchange between the CPU and memory," said Mr. Stephen Tai, President at Montage Technology. "With rising AI and machine learning demands, ever-greater computing power of CPU requires matching memory performance. Montage's latest DDR5 RCD04 unlocks higher memory bandwidth to remove bottlenecks for today's most demanding workloads."

In addition to its RCD lineup, Montage offers DDR5 Data Buffers (DB) and various essential supporting chips for DDR5 modules, such as SPD EEPROM with Hubs, Temperature Sensors, and Power Management ICs. When combined with the RCD chips, these components provide essential functionalities for DDR5 memory modules.

Top 20 HPC Solution Companies - 2019

Company
Montage Technology

Headquarters
San Jose, CA

Management
Geof Findley, VP of Sales and Business Development

Description
A global leading fabless semiconductor provider of high-performance IC based solutions for cloud computing and artificial intelligent markets

Top 20 HPC Solution Companies - 2019

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