Sequans and Foxconn Alliance to Commence LTE Products for IoT and M2M Apps

By CIOReview | Thursday, January 14, 2016
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FREMONT, CA: Sequans, the LTE chipmaker recently announced a strategic partnership with the Socle Technology corp, a subsidiary of Foxcon and system-on-chip (SoC) designer, to develop LTE-enabled IoT in the global market.

“Sequans is the leader in LTE for IoT chipsets, and we are pleased to establish this alliance,” said Stone Peng, president, Socle Technology Corp. “Our collaboration will allow us to bring best-in-class IoT-optimized LTE solutions to market quickly and to be very responsive to market needs as the LTE for IoT market continues its rapid development.”

Sequans designed and introduced the world's first and only IoT-optimized category 1 (CAT 1) LTE chipset that will be deployed on the LTE networks by this year. They are the leader in LTE for IoT and M2M chipsets and are developing solutions supporting 3GPP Release 13 category M (CAT M) and NarrowBand-IoT (NB-IoT) capabilities. They won IoT Innovation award from Connected World Magazine for their exceptional chipset platform to perform innovative IoT.

“Socle is an expert in SoC design, and we expect this partnership to yield a family of highly integrated solutions optimized for a variety of IoT segments,” said Georges Karam, CEO, Sequans. “I believe we have a compelling strategy, combining best-in-class technologies and access to new markets with privileged access to Foxconn IoT customers.”

The SoC Chip Design Platform provides a cost-efficient and specification-to-chip design total solution, which utilizes a highly integrated, pre-built, and system proven System-On-Chip design platform solution. It is built with the ARM7EJ or ARM9EJ RISC processor and embedded with rich sets of functional blocks for an application specific system needs.

IoT will be boosted up by the LTE network, which is up to 10 times faster than the current 3G, and will pave the way for connected World by the collaboration of Sequans and Socle.